HMLV Manufacturing
Flexible Manufacturing
Low volume; High mix; High reliability; Small-batch programs delivered with disciplined high-reliability standards
A stable manufacturing path for low-volume, high-mix programs
For prototypes, trial production, and low-volume manufacturing, Ledge brings material, process, test, and supply-chain judgement forward before production starts; Volumes may be small and product mix may be complex, but the delivery process must remain planned, traceable, and repeatable
Manufacturing Network
One Standard, Coordinated Across Manufacturing Nodes
Shenzhen Bao'an anchors process, supply-chain, and quality-control standards; Shenzhen Longgang supports flexible capacity; a future Canada node is planned to bring manufacturing and service closer to North American customers
Shenzhen Bao'an Base (Process and Quality Hub)
- SMT Line
- Automatic solder paste printing, 3D SPI, YAMAHA YSM10 + YSM20R, 10-zone reflow, inline AOI
- Inspection and Rework
- 4 offline AOI systems, 3 SMT intelligent first article inspection instruments, X-Ray, BGA rework station
- DIP and Assembly
- Selective wave soldering, automatic soldering, insertion line + wave soldering, ICT/FCT, conformal coating, assembly line
- Supporting Services
- CNC, 3D printing, injection molding
Shenzhen Longgang Base (Flexible Capacity)
Built with a partner to absorb higher-tempo SMT demand, larger DIP work, and expanded assembly space during temporary capacity peaks
Future Plan: Canada Manufacturing Node
A planned manufacturing and service node for North American customers; It is described as future capability development, not an operating production base
Engineering Discipline
Frontline Experience Built Into Engineering Capability
True flexible manufacturing depends not only on equipment parameters, but on the team's ability to turn experience into tools, process discipline, and traceability systems
The SMT intelligent first article inspection instrument was led by the company founder and core team members more than a decade ago and deployed in real production; It still reflects an advanced understanding of error prevention and traceability in electronics manufacturing; Its value is not the device alone, but the engineering judgement behind it: years of confronting human-error risk, frequent batch changeover, and traceability demands in high-reliability production, then turning that frontline experience into a repeatable process
Reduce human-error risk
Automatic comparison of component parameters moves missed or incorrect inspection risk into the first-article stage
Preserve process records
Inspection results are archived for batch traceability and abnormality review
Reflect industry depth
Only a team deeply rooted in high-reliability manufacturing would turn this kind of pain point into a tool
Experienced engineering team
Soldering specialists with 10+ years of IPC-A-610 Class 3 experience; dedicated NPI and process engineers; daily changeover across 10+ product types; proprietary tracking system for full-process traceability
Build a Deliverable Path From Trial Production
Clarify material risks, process plans, test paths, and low-volume manufacturing rhythm before choosing the right manufacturing route
Talk to an Engineer